50864-1 - TE Connectivity

CAD模型選擇

		LINA 明細表	PN Part Number ⁿ/ₐ	TEINTERNAL TE Internal # ⁿ/ₐ	TEINTERNALDESCRIPTION TE Internal Description ⁿ/ₐ	SLEEVESTYLE Sleeve Style ⁿ/ₐ	CONNECTORSYSTEM Connector System ⁿ/ₐ	SEALABLE Sealable ⁿ/ₐ	CONNECTORCONTACTTERMINATESTO Connector & Contact Terminates To ⁿ/ₐ	PRODUCTTYPE Product Type ⁿ/ₐ	PROFILE Profile ⁿ/ₐ	WIRECABLETYPE WireCable Type ⁿ/ₐ	SLEEVEPLATINGMATERIAL Sleeve Plating Material ⁿ/ₐ	SLEEVEMATERIAL Sleeve Material ⁿ/ₐ	CONTACTBASEMATERIAL Contact Base Material ⁿ/ₐ	CONTACTCURRENTRATINGMAXA Contact Current Rating Max [A]	CONTACTTYPE Contact Type ⁿ/ₐ	CONTACTSPRINGPLATINGTHICKNESS Contact Spring Plating Thickness ⁿ/ₐ	CONTACTSPRINGPLATINGMATERIAL Contact Spring Plating Material ⁿ/ₐ	CONTACTMATINGAREAPLATINGTHICKNESS Contact Mating Area Plating Thickness ⁿ/ₐ	CONTACTTRANSMITSTYPICAL Contact Transmits [Typical]	SOCKETTYPE Socket Type ⁿ/ₐ	TERMINATIONMETHODTOPRINTEDCIRCUITBOARD Termination Method to Printed Circuit Board ⁿ/ₐ	TERMINATIONMETHODTOWIRECABLE Termination Method to Wire & Cable ⁿ/ₐ	INSERTIONMETHOD Insertion Method ⁿ/ₐ	SOCKETLENGTH Socket Length ⁿ/ₐ	HOLESIZERECOMMENDED Hole Size [Recommended]	WIRESIZEAWG Wire Size [AWG]	WIRESIZEMM2 Wire Size [mm2]	MATINGPINDIAMETERRANGE Mating Pin Diameter Range ⁿ/ₐ	PCBTHICKNESSRECOMMENDED PCB Thickness [Recommended]	OPERATINGTEMPERATURERANGE Operating Temperature Range ⁿ/ₐ	SOLDERPROCESSFEATURE Solder Process Feature ⁿ/ₐ	CIRCUITAPPLICATION Circuit Application ⁿ/ₐ	PACKAGINGMETHOD Packaging Method ⁿ/ₐ	PACKAGINGQUANTITY Packaging Quantity ⁿ/ₐ	SPRINGMATERIAL Spring Material ⁿ/ₐ

SOCKET,MIN-SPR SN-AU SER-...

Printed Circuit Board

Beryllium Copper

.762 um [ 30 uin ]

30 um [ 30 uin ]

Signal (Data)Power

Through Hole - Press-Fit

HandSemi-AutomaticAutomat...

6.53 mm [ .257 in ]

1.57 mm [ .062 in ]

.66 - .84 mm [ .026 - .03...

.79 - 3.18 mm [ .031 - .1...

-65 - 125 C [ -85 - 257 F...

Bag, Loose Piece

Beryllium Copper